Huawei's upcoming flagship chip, built on innovative 3D IC stacking and the proprietary Tau Law, achieves performance parity with TSMC's 3nm process while bypassing EUV lithography constraints.
I’ve already explained how this same argument was made about BYD, and that within a few years it leapfrogged the best western EVs. Exact same thing is happening with Huawei right now, except they literally just started doing this stuff only a few years ago when the heavy US export bans on chips started. Yet, within this very short period they already make phones that are functionally comparable to the best Android or iOS phones. While the hardware is a bit slower, it’s compensated for by a more lean software stack, and the end user experience is not actually all that different. That’s what I meant when I said you obviously have not used one. So, while Apple might have better specs on paper, it’s the entire stack and the end experience which actually matters. Now kindly gtfo with your own shit.
I’ve already explained how this same argument was made about BYD, and that within a few years it leapfrogged the best western EVs. Exact same thing is happening with Huawei right now, except they literally just started doing this stuff only a few years ago when the heavy US export bans on chips started. Yet, within this very short period they already make phones that are functionally comparable to the best Android or iOS phones. While the hardware is a bit slower, it’s compensated for by a more lean software stack, and the end user experience is not actually all that different. That’s what I meant when I said you obviously have not used one. So, while Apple might have better specs on paper, it’s the entire stack and the end experience which actually matters. Now kindly gtfo with your own shit.